HOT Jobs: Process Engineer in Selangor, Malaysia
Monday, June 8, 2009 14:19
A multinational company in Selangor, Malaysia is actively looking for a Process Engineer specialized in Semiconductor Die Bonding process. If you are a Malaysian with the following experience and willing to venture into a more challenging responsibilities, please submit your resume to career_advisor@resumeweassist.com. We will work with your future employer to access your suitability for an interview.
Responsibilities:
• Statistically control the process and ensure 6 sigma quality.
• Maintain all dam and fill process documents and ensure ZERO audit failure.
• Lead process improvement and optimization in terms of yield and output.
• Work with GAO to qualify new substrate/compound & fan out across packages.
• Manage manufacturing day to day lots disposition.
• Manage process capability/robustness improvement.
• Achieve yield of 99.7% process yield for die bond process.
Requirements:
• Bachelors degree in Electrical & Electronics or Mechanical and/or Materials Engineering discipline, preferably with min 1 years of relevant working experience.
• Experience in semiconductor assembly and applied statistics will be an advantage.
• Have good leadership skills and able to drive the die bond team.
• Strong interpersonal and communication skills.
• Good decision making / problem solving skills.
• Willing to work hard.
