ResumeWeAssist Enterprise

Another GREAT opportunity for Semiconductor Wire Bonding experts in Malaysia. A world leading semiconductor company in Melaka, Malaysia is looking for experts in semiconductor wire bonding to be involved in process optimization on during new package/ new platform development especially for leaded packages. Involve heavily in New Product Introduction (NPI). Identify, evaluate and resolve technical wire bonding process problems through a systematic approach.

Those with Degree in Engineering (Semiconductor Technology, Microelectronics, Material Science, Applied Science or Electrical & Electronics/Chemical Engineering) and minimum 2 years experience in wire bonding process are highly encourage to send your resume to career_advisor@resumeweassist.com. They are also looking for a team player with good problem-solving skills with knowledge in 6 sigma Green/Black Belt implementation. Added knowledge on Leadframe/ CU Wire bonding will be an advantage.

We at ResumeWeAssist.com will work with your future employer to access your suitability for an interview.

Good luck!